Asset Details
Do you wish to reserve the book?
Microstructure and Damage Evolution During Thermal Cycling of Sn-Ag-Cu Solders Containing Antimony
Hey, we have placed the reservation for you!
By the way, why not check out events that you can attend while you pick your title.
Oops! Something went wrong.
Looks like we were not able to place the reservation. Kindly try again later.
Are you sure you want to remove the book from the shelf?
Microstructure and Damage Evolution During Thermal Cycling of Sn-Ag-Cu Solders Containing Antimony
Do you wish to request the book?
Microstructure and Damage Evolution During Thermal Cycling of Sn-Ag-Cu Solders Containing Antimony
Please be aware that the book you have requested cannot be checked out. If you would like to checkout this book, you can reserve another copy
We have requested the book for you!
Your request is successful and it will be processed during the Library working hours. Please check the status of your request in My Requests.
Oops! Something went wrong.
Looks like we were not able to place your request. Kindly try again later.
Journal Article
Microstructure and Damage Evolution During Thermal Cycling of Sn-Ag-Cu Solders Containing Antimony
2021
Overview
Antimony is attracting interest as an addition to Pb-free solders to improve thermal cycling performance in harsher conditions. Here, we investigate microstructure evolution and failure in harsh accelerated thermal cycling (ATC) of a Sn-3.8Ag-0.9Cu solder with 5.5 wt.% antimony as the major addition in two ball grid array (BGA) packages. SbSn particles are shown to precipitate on both Cu
6
Sn
5
and as cuboids in β-Sn, with reproducible orientation relationships and a good lattice match. Similar to Sn-Ag-Cu solders, the microstructure and damage evolution were generally localised in the β-Sn near the component side where localised β-Sn misorientations and subgrains, accelerated SbSn and Ag
3
Sn particle coarsening, and β-Sn recrystallisation occurred. Cracks grew along the network of recrystallised grain boundaries to failure. The improved ATC performance is mostly attributed to SbSn solid-state precipitation within β-Sn dendrites, which supplements the Ag
3
Sn that formed in a eutectic reaction between β-Sn dendrites, providing populations of strengthening particles in both the dendritic and eutectic β-Sn.
Publisher
Springer US,Springer Nature B.V
