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Strain-dependent grain boundary properties of n-type germanium layers
by
Takashi Suemasu
, Kota Igura
, Koki Nozawa
, Takamitsu Ishiyama
, Kaoru Toko
in
639/166/987
/ 639/301/1005/1007
/ 639/766/25
/ Crystallization
/ Electrical properties
/ Germanium
/ Grain boundaries
/ Humanities and Social Sciences
/ Low temperature
/ Medicine
/ Mobility
/ multidisciplinary
/ Q
/ R
/ Science
/ Science (multidisciplinary)
/ Thermal expansion
/ Thin films
2024
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Strain-dependent grain boundary properties of n-type germanium layers
by
Takashi Suemasu
, Kota Igura
, Koki Nozawa
, Takamitsu Ishiyama
, Kaoru Toko
in
639/166/987
/ 639/301/1005/1007
/ 639/766/25
/ Crystallization
/ Electrical properties
/ Germanium
/ Grain boundaries
/ Humanities and Social Sciences
/ Low temperature
/ Medicine
/ Mobility
/ multidisciplinary
/ Q
/ R
/ Science
/ Science (multidisciplinary)
/ Thermal expansion
/ Thin films
2024
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Strain-dependent grain boundary properties of n-type germanium layers
by
Takashi Suemasu
, Kota Igura
, Koki Nozawa
, Takamitsu Ishiyama
, Kaoru Toko
in
639/166/987
/ 639/301/1005/1007
/ 639/766/25
/ Crystallization
/ Electrical properties
/ Germanium
/ Grain boundaries
/ Humanities and Social Sciences
/ Low temperature
/ Medicine
/ Mobility
/ multidisciplinary
/ Q
/ R
/ Science
/ Science (multidisciplinary)
/ Thermal expansion
/ Thin films
2024
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Strain-dependent grain boundary properties of n-type germanium layers
Journal Article
Strain-dependent grain boundary properties of n-type germanium layers
2024
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Overview
Polycrystalline Ge thin films have attracted considerable attention as potential materials for use in various electronic and optical devices. We recently developed a low-temperature solid-phase crystallization technology for a doped Ge layer and achieved the highest electron mobility in a polycrystalline Ge thin film. In this study, we investigated the effects of strain on the crystalline and electrical properties of n-type polycrystalline Ge layers. By inserting a GeO
x
interlayer directly under Ge and selecting substrates with different coefficients of thermal expansion, we modulated the strain in the polycrystalline Ge layer, ranging from approximately 0.6% (tensile) to − 0.8% (compressive). Compressive strain enlarged the grain size to 12 µm, but decreased the electron mobility. The temperature dependence of the electron mobility clarified that changes in the potential barrier height of the grain boundary caused this behavior. Furthermore, we revealed that the behavior of the grain boundary barrier height with respect to strain is opposite for the n- and p-types. This result strongly suggests that this phenomenon is due to the piezoelectric effect. These discoveries will provide guidelines for improving the performance of Ge devices and useful physical knowledge of various polycrystalline semiconductor thin films.
Publisher
Springer Science and Business Media LLC,Nature Publishing Group UK,Nature Publishing Group,Nature Portfolio
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