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Decomposition of Cu sub(6)Sn sub(5) particles in solder for the growth of a ternary (Cu sub(1-x)Ni sub(x)) sub(6)Sn sub(5) layer on a Ni substrate
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Decomposition of Cu sub(6)Sn sub(5) particles in solder for the growth of a ternary (Cu sub(1-x)Ni sub(x)) sub(6)Sn sub(5) layer on a Ni substrate
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Decomposition of Cu sub(6)Sn sub(5) particles in solder for the growth of a ternary (Cu sub(1-x)Ni sub(x)) sub(6)Sn sub(5) layer on a Ni substrate
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Journal Article
Decomposition of Cu sub(6)Sn sub(5) particles in solder for the growth of a ternary (Cu sub(1-x)Ni sub(x)) sub(6)Sn sub(5) layer on a Ni substrate
2009
Overview
The interaction between Cu sub(6)Sn sub(5) particles in the bulk of a solder and a Ni substrate was examined during solid-state aging using Cu/Sn/Ni and Cu/Sn/Cu/Sn/Ni diffusion couples with initially thin Cu layers. The results clearly demonstrated that the (Cu,Ni) sub(6)Sn sub(5) particles dispersed in the bulk solder decomposed in order for a ternary (Cu sub(1-x)Ni sub(x)) sub(6)Sn sub(5) layer to grow at the solder/Ni interface during solid-state aging. The interaction between the (Cu,Ni) sub(6)Sn sub(5) particles and the (Cu sub(1-x)Ni sub(x)) sub(6)Sn sub(5) layer occurs owing to the driving force for the (Cu,Ni) sub(6)Sn sub(5) compound to become saturated with Ni. A (Ni,Cu) sub(3)Sn sub(4) layer forms at the (Cu sub(1-x)Ni sub(x)) sub(6)Sn sub(5)/Ni interface only after the Ni composition of the (Cu,Ni) sub(6)Sn sub(5) phase in the bulk solder approaches that of the (Cu sub(1-x)Ni sub(x)) sub(6)Sn sub(5) layer. Once the (Ni,Cu) sub(3)Sn sub(4) layer has formed, it grows at an exceptionally rapid rate by consuming the (Cu sub(1-x)Ni sub(x)) sub(6)Sn sub(5) and Sn layers, which can be problematic in solder joint reliability.
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