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The Effects of Precursors on the Morphology and Chemical Mechanical Polishing Performance of Ceria-Based Abrasives
The Effects of Precursors on the Morphology and Chemical Mechanical Polishing Performance of Ceria-Based Abrasives
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The Effects of Precursors on the Morphology and Chemical Mechanical Polishing Performance of Ceria-Based Abrasives
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The Effects of Precursors on the Morphology and Chemical Mechanical Polishing Performance of Ceria-Based Abrasives
The Effects of Precursors on the Morphology and Chemical Mechanical Polishing Performance of Ceria-Based Abrasives
Journal Article

The Effects of Precursors on the Morphology and Chemical Mechanical Polishing Performance of Ceria-Based Abrasives

2022
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Overview
Ceria-based abrasives are widely used in precision chemical mechanical polishing (CMP) fields, such as thin film transistor liquid crystal display (TFT-LCD) glass substrates and integrated circuits, because of their excellent physicochemical properties. Rare earth carbonates, as precursors of ceria-based abrasives, directly affect the morphology of ceria-based abrasives, which, in turn, affects the material removal rate (MRR) and the surface roughness (Ra) after polishing. Herein, rare earth carbonates with different morphologies were obtained by adjusting reaction parameters during precipitation, including flake, spindle, and spheroid. Moreover, the phase of precursors was analyzed, and the evolution process of morphology from precursors to ceria-based abrasives was investigated. Furthermore, the effect of precursors on the polishing performance of ceria-based abrasives was explored. The results show that the primary particles of ceria-based abrasives are near-spherical, but the morphology and dispersion of the secondary particles are obviously inherited from precursors. Among them, near-spherical ceria-based abrasives prepared by nearly monodisperse near-spherical precursors show better uniformity and higher dispersion, and they not only achieve the lowest Ra but also obtain a higher MRR of 555 nm/min (9 wt.%) for polishing TFT-LCD glass substrates. The result is significant for the further optimization and application of high-performance ceria-based abrasives.