Asset Details
Do you wish to reserve the book?
Rigid/flexible molecular structure‐induced polyimide aerogels with ultralow permittivity and thermal insulation properties
Hey, we have placed the reservation for you!
By the way, why not check out events that you can attend while you pick your title.
Oops! Something went wrong.
Looks like we were not able to place the reservation. Kindly try again later.
Are you sure you want to remove the book from the shelf?
Rigid/flexible molecular structure‐induced polyimide aerogels with ultralow permittivity and thermal insulation properties
Do you wish to request the book?
Rigid/flexible molecular structure‐induced polyimide aerogels with ultralow permittivity and thermal insulation properties
Please be aware that the book you have requested cannot be checked out. If you would like to checkout this book, you can reserve another copy
We have requested the book for you!
Your request is successful and it will be processed during the Library working hours. Please check the status of your request in My Requests.
Oops! Something went wrong.
Looks like we were not able to place your request. Kindly try again later.
Journal Article
Rigid/flexible molecular structure‐induced polyimide aerogels with ultralow permittivity and thermal insulation properties
2023
Overview
A series of high‐performance linear and cross‐linked polyimide (PI) aerogels with different molecular structures have been successfully synthesised using the freeze‐drying process. In this study, the comprehensive regulation of microstructure, thermodynamic, thermal insulation and dielectric properties of PI aerogels are achieved by controlling the rigid/flexible structure and composition of polymerised monomers. The increase in rigidity of PI molecular structure could promote the formation of denser pores, which is beneficial to improve the thermodynamic and thermal insulation properties of aerogels. Notably, the cross‐linked PI aerogel prepared by introducing cross‐linking agent (tris(4‐aminophenyl) amine, [TPA]) into linear PI exhibits high thermal stability ( T d 5% > 560°C), excellent ultralow permittivity ( ε r = 1.31, f = 10 6 Hz) and good thermal insulation property ( k = 0.056 W/m · K). This innovative strategy promotes the wider application of the cross‐linked polyimide aerogel in the field of integrated circuits and aerospace exploration.
