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Universal cryogenic transfer of liquid metal particles in polymers for wafer-scale stretchable integrated electronics
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Universal cryogenic transfer of liquid metal particles in polymers for wafer-scale stretchable integrated electronics
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Journal Article
Universal cryogenic transfer of liquid metal particles in polymers for wafer-scale stretchable integrated electronics
2026
Overview
Gallium-based liquid metals (LMs) are promising materials for stretchable electronics due to their metallic conductivity and deformability. However, the fabrication of large-area stretchable integrated electronics using LMs on various polymers remains challenging due to their high surface tension, fluidity, and poor wettability. Current techniques, such as selective wetting and lift-off processes, face limitations related to substrate compatibility and Ga/metal alloying, hindering their applicability in integrated electronic systems. To address these challenges, we developed a high-resolution top-down etching-based photolithography combined with a universal cryogenic transfer method for transferring patterned LM particles (LMPs) in various polymer substrates. The cryogenic environment modifies the interfacial bonding between the LMPs and substrates, resulting in a universal transfer. The resulting liquid metal particle network embedded polymer (LNEP) exhibits high electrical conductivity (~1.71 × 10⁶ S/m), stability, and strain-insensitive performance across various polymers. This process is scalable to large-area fabrication, overcoming the limitations of existing LM patterning techniques. Leveraging this approach, we demonstrated the use of LNEP ranging from skin-conformal wearable sensors to hybrid stretchable circuits and implantable devices, demonstrating the universality of the method. This technique establishes a scalable pathway for stretchable electronics in advanced applications.
Stretchable liquid-metal electronics is limited by high surface tension, fluidity, and poor wettability. Here, Lee et. al. presents a universal cryogenic transfer method for liquid metal particles, enabling high-throughput fabrication of wafer-scale stretchable integrated electronics with robust electrical performance.
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