Journal Article

Interface optimization of graphene paper–Cu composite prepared by electrodeposition

Zhang, Peng, Zhang, Wei-yang, Tang, Jing-yu, Wang, Hai-jing, Liu, Shuang-juan, Wang, Peng-cheng, Guo, Jing, Meng, Cai, Guo, Han-jie

2024

Overview

A room-temperature electrodeposition method with an organic electrolyte was developed to fabricate a HNO 3 -pretreated graphene paper Cu (GP′–Cu) composite. To improve the interfacial bonding of GP′–Cu composite, magnetron sputtering technology was used to create a “sandwich” structural gradient GP′–Cu composite. The selection of the intermediate transition layer metal was based on two-dimensional disregistry. Scanning electron microscopy, X-ray photoelectron spectroscopy, and other analytical methods confirmed that the addition of an intermediate transition metal (Cr, Ni) layer reduced the gap distance and enhanced the interfacial bonding of the GP′ and Cu deposited layers. The GP′–Ni–Cu composite exhibited the largest increase in tensile strength and conductivity. In addition, it had the highest thermal diffusivity and elongation at break among the GP′–Cu, GP′–Cr–Cu and GP′–Ni–Cu composites.

• Publisher: Springer Nature Singapore,Springer Nature B.V
• Subject: Applied and Technical Physics / Bonding / Carbon / Composite materials / Copper / Electrodeposition / Electrolytes / Engineering / Graphene / Interfaces / Interfacial bonding / Machines / Magnetron sputtering / Manufacturing / Materials Engineering / Materials Science / Metallic Materials / Nickel / Nonaqueous electrolytes / Original Paper / Photoelectrons / Physical Chemistry / Processes / Radiation / Room temperature / Spectrum analysis / Tensile strength / Thermal diffusivity / Transition layers / Transition metals / X ray photoelectron spectroscopy