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Evolution of microstructure and elevated-temperature properties during hot rolling and post-rolling annealing process in Al-Mg-Si 6082 alloys
by
Li, C.
, Chen, X.-G.
, Liu, K.
in
al-mg-si 6082 alloy
/ Alloys
/ Aluminum base alloys
/ Annealing
/ Coarsening
/ Dimpling
/ Dispersions
/ dispersoids, elevated-temperature properties
/ Ductile fracture
/ Evolution
/ Fracture surfaces
/ Heat treating
/ Heat treatment
/ Hot rolling
/ Intermetallic compounds
/ Magnesium compounds
/ Manganese
/ Metal silicides
/ Microhardness
/ Microstructure
/ Morphology
/ post -rolling annealing
/ Recrystallization
/ Room temperature
/ Silicon
/ Yield strength
2020
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Evolution of microstructure and elevated-temperature properties during hot rolling and post-rolling annealing process in Al-Mg-Si 6082 alloys
by
Li, C.
, Chen, X.-G.
, Liu, K.
in
al-mg-si 6082 alloy
/ Alloys
/ Aluminum base alloys
/ Annealing
/ Coarsening
/ Dimpling
/ Dispersions
/ dispersoids, elevated-temperature properties
/ Ductile fracture
/ Evolution
/ Fracture surfaces
/ Heat treating
/ Heat treatment
/ Hot rolling
/ Intermetallic compounds
/ Magnesium compounds
/ Manganese
/ Metal silicides
/ Microhardness
/ Microstructure
/ Morphology
/ post -rolling annealing
/ Recrystallization
/ Room temperature
/ Silicon
/ Yield strength
2020
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Evolution of microstructure and elevated-temperature properties during hot rolling and post-rolling annealing process in Al-Mg-Si 6082 alloys
by
Li, C.
, Chen, X.-G.
, Liu, K.
in
al-mg-si 6082 alloy
/ Alloys
/ Aluminum base alloys
/ Annealing
/ Coarsening
/ Dimpling
/ Dispersions
/ dispersoids, elevated-temperature properties
/ Ductile fracture
/ Evolution
/ Fracture surfaces
/ Heat treating
/ Heat treatment
/ Hot rolling
/ Intermetallic compounds
/ Magnesium compounds
/ Manganese
/ Metal silicides
/ Microhardness
/ Microstructure
/ Morphology
/ post -rolling annealing
/ Recrystallization
/ Room temperature
/ Silicon
/ Yield strength
2020
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Evolution of microstructure and elevated-temperature properties during hot rolling and post-rolling annealing process in Al-Mg-Si 6082 alloys
Journal Article
Evolution of microstructure and elevated-temperature properties during hot rolling and post-rolling annealing process in Al-Mg-Si 6082 alloys
2020
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Overview
In the present work, the hot rolling at 400°C and post-rolling annealing at 500°C were applied on heat-treated Al-Mg-Si 6082 alloys with different Mn contents to study the evolution of microstructure and elevated-temperature properties. During the pre-heat treatment before rolling (400°C/2h), a number of fine rod-like dispersoids formed in Mn-containing alloy while only high volume of larger Mg 2 Si particles was observed in the matrix of base alloy free of Mn. After hot rolling, the morphology of dispersoids was transferred from rod-like to spherical with finer size and increased number density while the dispersoids gradually coarsened during post-rolling annealing in Mn-containing alloy. The full recrystallization was completed after 1-2 h during annealing in the base alloy, while only partial recrystallization was observed in Mn-containing alloy. The micro-hardness at room temperature and the tensile yield strength at 300°C firstly increased from as-rolled condition to the initial stage of annealing (1 h) for both alloys, which was likely attributed to the dissolution of Mg 2 Si during the beginning of annealing. With further increasing annealing time (2-8 h), both the microhardness at room temperature and the elevated-temperature strengths of the base alloy remained similar, while they were slightly decreased in Mn-containing alloy owing to the partially recrystallization and coarsening of dispersoids. However, the elevated-temperature strengths were always higher in Mn-containing alloy than the base alloy while their differences between two alloys was reducing with prolonging the post-rolling annealing time. The tensile fracture surface was observed to be ductile for all the conditions of both alloys but the dimples in Mn-containing alloy were finer and much more uniformly distributed.
Publisher
EDP Sciences
Subject
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