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Rapid Full-Field Surface Topography Measurement of Large-Scale Wafers Using Interferometric Imaging
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Rapid Full-Field Surface Topography Measurement of Large-Scale Wafers Using Interferometric Imaging
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Journal Article
Rapid Full-Field Surface Topography Measurement of Large-Scale Wafers Using Interferometric Imaging
2025
Overview
Rapid full-field surface topography measurement for large-scale wafers remains challenging due to limitations in speed, system complexity, and scalability. This work presents a interferometric system based on thin-film interference for high-precision wafer profiling. An optical flat serves as the reference surface, forming a parallel air-gap structure with the wafer under test. A large-aperture collimated beam is introduced via an off-axis parabolic mirror to generate high-contrast interference fringes across the entire field of view. Once the wafer is fully illuminated, topographic information is directly extracted from the fringe pattern. Comparative measurements with a commercial interferometer show relative deviations below 3% in bow and warp, confirming the system’s accuracy and stability. With its simple optical layout, low cost, and robust performance, the proposed method shows strong potential for industrial applications in wafer inspection and online surface monitoring.
Publisher
MDPI AG
Subject
