Asset Details
Do you wish to reserve the book?
Microstructural and Mechanical Characterization of Cu/SnAg Pillar Bumps with Ni-Less Surface Finish Utilizing Laser-Assisted Bonding (LAB)
Hey, we have placed the reservation for you!
By the way, why not check out events that you can attend while you pick your title.
Oops! Something went wrong.
Looks like we were not able to place the reservation. Kindly try again later.
Are you sure you want to remove the book from the shelf?
Microstructural and Mechanical Characterization of Cu/SnAg Pillar Bumps with Ni-Less Surface Finish Utilizing Laser-Assisted Bonding (LAB)
Do you wish to request the book?
Microstructural and Mechanical Characterization of Cu/SnAg Pillar Bumps with Ni-Less Surface Finish Utilizing Laser-Assisted Bonding (LAB)
Please be aware that the book you have requested cannot be checked out. If you would like to checkout this book, you can reserve another copy
We have requested the book for you!
Your request is successful and it will be processed during the Library working hours. Please check the status of your request in My Requests.
Oops! Something went wrong.
Looks like we were not able to place your request. Kindly try again later.
Journal Article
Microstructural and Mechanical Characterization of Cu/SnAg Pillar Bumps with Ni-Less Surface Finish Utilizing Laser-Assisted Bonding (LAB)
2025
Overview
In this study, an interconnection was formed between a Cu/SnAg pillar bump and an Ni-less surface-treated Cu pad through laser-assisted bonding (LAB), and its bonding characteristics were evaluated. The LAB process influences the bond quality and mechanical strength based on the laser irradiation time and laser power density. The growth of the intermetallic compound (IMC) in the joint cross-section was observed via FE-SEM analysis. Under optimized LAB conditions, minimal IMC growth and high bonding strength were achieved compared to conventional thermo-compression bonding (TCB) and mass reflow (MR) processes. As the laser irradiation time and laser power density increased, solder splashing was observed at bump temperatures above 300 °C. This is hypothesized to be due to the rapid temperature rise causing the flux to vaporize explosively, resulting in simultaneous solder splashing. With increasing laser power density, the failure mode transitioned from the solder to the IMC.
Publisher
MDPI AG,MDPI
Subject
