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High power density gallium nitride radio frequency transistors via enhanced nucleation in heteroepitaxy
by
Wang, Baiqi
, Cheng, Zhe
, Wang, Xinqiang
, Dong, Yaolong
, Chen, Tangsheng
, Hao, Yue
, Liu, Zhihong
, Xu, Shengrui
, Zhang, Jincheng
, Zhou, Shutong
, Liu, Wenjun
, Zhang, Chunfu
, Huang, Zifeng
, Liu, Fang
, Zhang, Yachao
, Zhang, Yuhao
, Gong, Hehe
, Wang, Shuai
, Zhou, Min
, Liu, Jinwen
, Zhang, Chaoqun
, Tang, Shijun
, Zhang, Kun
, Xu, Zuyin
, Zhou, Hong
, Wang, Han
in
639/301/1005/1007
/ 639/925/927/1007
/ Buffer layers
/ Coalescence
/ Dislocation density
/ Extremely high frequencies
/ Figure of merit
/ Gallium
/ Gallium nitrides
/ High electron mobility transistors
/ Humanities and Social Sciences
/ Interfaces
/ Ion implantation
/ Microscopy
/ Morphology
/ multidisciplinary
/ Nucleation
/ Radio frequency
/ Satellite communications
/ Science
/ Science (multidisciplinary)
/ Semiconductor devices
/ Semiconductors
/ Silicon
/ Silicon carbide
/ Silicon substrates
/ Thermal resistance
/ Thickness
/ Transistors
2025
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High power density gallium nitride radio frequency transistors via enhanced nucleation in heteroepitaxy
by
Wang, Baiqi
, Cheng, Zhe
, Wang, Xinqiang
, Dong, Yaolong
, Chen, Tangsheng
, Hao, Yue
, Liu, Zhihong
, Xu, Shengrui
, Zhang, Jincheng
, Zhou, Shutong
, Liu, Wenjun
, Zhang, Chunfu
, Huang, Zifeng
, Liu, Fang
, Zhang, Yachao
, Zhang, Yuhao
, Gong, Hehe
, Wang, Shuai
, Zhou, Min
, Liu, Jinwen
, Zhang, Chaoqun
, Tang, Shijun
, Zhang, Kun
, Xu, Zuyin
, Zhou, Hong
, Wang, Han
in
639/301/1005/1007
/ 639/925/927/1007
/ Buffer layers
/ Coalescence
/ Dislocation density
/ Extremely high frequencies
/ Figure of merit
/ Gallium
/ Gallium nitrides
/ High electron mobility transistors
/ Humanities and Social Sciences
/ Interfaces
/ Ion implantation
/ Microscopy
/ Morphology
/ multidisciplinary
/ Nucleation
/ Radio frequency
/ Satellite communications
/ Science
/ Science (multidisciplinary)
/ Semiconductor devices
/ Semiconductors
/ Silicon
/ Silicon carbide
/ Silicon substrates
/ Thermal resistance
/ Thickness
/ Transistors
2025
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High power density gallium nitride radio frequency transistors via enhanced nucleation in heteroepitaxy
by
Wang, Baiqi
, Cheng, Zhe
, Wang, Xinqiang
, Dong, Yaolong
, Chen, Tangsheng
, Hao, Yue
, Liu, Zhihong
, Xu, Shengrui
, Zhang, Jincheng
, Zhou, Shutong
, Liu, Wenjun
, Zhang, Chunfu
, Huang, Zifeng
, Liu, Fang
, Zhang, Yachao
, Zhang, Yuhao
, Gong, Hehe
, Wang, Shuai
, Zhou, Min
, Liu, Jinwen
, Zhang, Chaoqun
, Tang, Shijun
, Zhang, Kun
, Xu, Zuyin
, Zhou, Hong
, Wang, Han
in
639/301/1005/1007
/ 639/925/927/1007
/ Buffer layers
/ Coalescence
/ Dislocation density
/ Extremely high frequencies
/ Figure of merit
/ Gallium
/ Gallium nitrides
/ High electron mobility transistors
/ Humanities and Social Sciences
/ Interfaces
/ Ion implantation
/ Microscopy
/ Morphology
/ multidisciplinary
/ Nucleation
/ Radio frequency
/ Satellite communications
/ Science
/ Science (multidisciplinary)
/ Semiconductor devices
/ Semiconductors
/ Silicon
/ Silicon carbide
/ Silicon substrates
/ Thermal resistance
/ Thickness
/ Transistors
2025
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High power density gallium nitride radio frequency transistors via enhanced nucleation in heteroepitaxy
Journal Article
High power density gallium nitride radio frequency transistors via enhanced nucleation in heteroepitaxy
2025
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Overview
Gallium-nitride high-electron-mobility-transistor is an industrial leading contender for high-frequency and high-power radio-frequency applications. However, the record output-power-density has remained stagnant for nearly two decades, limited by high thermal-resistances at the nucleation layer-substrate interface and thick nitride layers. Here, we propose induced nucleation by implementing ion-implantation on silicon-carbide substrate to create nano- to microscale surface nucleation-sites. This approach suppresses conventional island-like nucleation, enabling rapid film coalescence and aggressive reduction in buffer layer thickness while maintaining low dislocation density. Therefore, a low thermal-resistance of 3.9 m²K/GW for the entire epitaxial stack is achieved, three times lower than previous reports in various high-electron-mobility-transistor epi-structures. Gallium-nitride transistors demonstrate a record Johnson’s Figure-of-Merit of 20.6 THz·V, an output-power-density of 42/20 W/mm at 8/30 GHz, representing a 30%/43% improvement over prior highest output-power-density for all X-/Ka-band transistors, respectively. This result manifests the implantation-induced nucleation strategy as a promising approach for advancing Gallium-nitride heteroepitaxy for RF electronics.
Achieving high output-power-density in Gallium-nitride transistors is challenging due to high thermal resistances and thick nitride layers. Here, the authors propose ion-implantation on silicon-carbide substrates, achieving high performance and reduced thermal resistance.
Publisher
Nature Publishing Group UK,Nature Publishing Group,Nature Portfolio
Subject
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